Individual Final Project
Final project documentations:
MycoBoard MycoBoard engineers the fungus Neurospora crassa to grow flat hyphal mats that function as biodegradable, breadboard-like electronic substrates. Overexpression of the metallothionein gene cmt drives copper ion capture and reduction into conductive nanoparticles along hyphal walls, making the fungus an active circuit architect of the object itself. Mats grown in molds guide the hyphal geometry via its thigmotropism, and conductive tracks are applied via stamp or screen print to emulate the typical Breadboard. The result decomposes in soil within weeks or months, unlike conventional FR4 fiberglass PCBs that contribute to the ongoing e-waste crisis.
HTGAA 2026: Individual Final Project Documentation
FINAL PRESENTATION SLIDES SECTION 1: ABSTRACT MycoBoard addresses the global e-waste crisis by engineering the fungi Neurospora crassa to grow biodegradable hyphal mats that function as breadboard-like electronic substrates. Conventional FR4 fiberglass PCBs contribute to the 62 million metric tons of annual e-waste, most of which is non-recyclable. MycoBoard leverages fungal thigmotropism to form conductive tracks within molded mats, with cmt metallothionein overexpression driving copper ion capture along the hyphae walls of N.crassa. The purpose is to create compostable electronic substrates that can break down in soil within weeks. The principle, validated by a Benchling-designed linear cassette and literature-based copper-loading estimates, states that engineered N. crassa could both biosorb copper and form conductive pathways via filamentous formation of hyphae. Aim 1 designs and validates a linear cassette construct for copper-responsive expression of cmt. Aim 2 transforms N. crassa experimentally, grows mats in breadboard molds, and tests LED circuit conductivity. Aim 3 replaces molds with optogenetic cmt control for pattern-directed copper deposition. Methods include Benchling DNA design, Twist synthesis, spheroplast electroporation, fungal mat cultivation, and multimeter/resistance validation.